2 papers
physics.gen-ph2008
High Performance Thermal Interface Technology Overview
R. Linderman, T. Brunschwiler, B. Smith +1
An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with…
physics.gen-ph2008
Utility of transient testing to characterize thermal interface materials
B. Smith, T. Brunschwiler, B. Michel
This paper analyzes a transient method for the characterization of low-resistance thermal interfaces of microelectronic packages. The transient method can yield additional informat…