5 citations · 7 across the 4 of their papers we have counts for
4 papers
Characterization and Modeling of an Electro-thermal MEMS Structure
P. G. Szabo, Vladimir Szekely
Thermal functional circuits are an interesting and perspectivic group of the MEMS elements. A practical realization is called Quadratic Transfer Characteristic (QTC) element which…
Short time die attach characterisation of semiconductor devices
P. Szabo, M. Rencz
Thermal qualification of the die attach of semiconductor devices is a very important element in the device characterization as the temperature of the chip is strongly affected by t…
Characterisation of the Etching Quality in Micro-Electro-Mechanical Systems by Thermal Transient Methodology
P. Szabo, B. Nemeth, M. Rencz +1
Our paper presents a non-destructive thermal transient measurement method that is able to reveal differences even in the micron size range of MEMS structures. Devices of the same d…
Thermal measurement and modeling of multi-die packages
A. Poppe, Y. Zhang, J. Wilson +3
Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stac…