5 citations · 7 across the 3 of their papers we have counts for
3 papers
physics.gen-ph2008
Short time die attach characterisation of semiconductor devices
P. Szabo, M. Rencz
Thermal qualification of the die attach of semiconductor devices is a very important element in the device characterization as the temperature of the chip is strongly affected by t…
cs.OH2007★ 2 cited
Characterisation of the Etching Quality in Micro-Electro-Mechanical Systems by Thermal Transient Methodology
P. Szabo, B. Nemeth, M. Rencz +1
Our paper presents a non-destructive thermal transient measurement method that is able to reveal differences even in the micron size range of MEMS structures. Devices of the same d…
cond-mat.mtrl-sci2007★ 5 cited
Thermal measurement and modeling of multi-die packages
A. Poppe, Y. Zhang, J. Wilson +3
Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stac…