3 papers
physics.gen-ph2008
New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors
Satoshi Kondo, Qiang Yu, T. Shibutani +1
As the integration and the miniaturization of electronics devices, design space become narrower and interactions between design factors affect their reliability. This paper present…
cond-mat.mtrl-sci2007
Reliability Evaluation Method for Electronic Device BGA Package Considering the Interaction Between Design Factors
S. Kondo, Qiang Yu, T. Shibutani +1
The recent development of electric and electronic devices has been remarkable. The miniaturization of electronic devices and high integration are progressing by advances in mountin…
cond-mat.mtrl-sci2007
Modeling with structure of resins in electonic compornents
Q. Yu, T. Shibutani, M. Shiratori +2
In recent years, interfacial fracture becomes one of the most important problems in the assessment of reliability of electronics packaging. Especially, underfill resin is used with…