activity
20242026
most citedInterfacial reaction boosts thermal conductance of room-temperature integrated semiconductor interfaces stable up to 1100 C

3 citations · 3 across the 7 of their papers we have counts for

collaborators

10 papers

physics.app-ph2026

Resolving the Thermal Labyrinth inside 3D-IC Stacks

Xufei Guo, Yiyun He, Zirou Chen +3

The heat pathways in 3D-ICs have long been a labyrinth lacking experimental investigations into spatial distribution of thermal properties, severely limiting study of internal ther…

cond-mat.mtrl-sci2026

Strong Thermal Conductivity Suppression in Isotope Purified Single Crystal Diamond with Phonon Scatterings of Color Centers

Jinwen Liu, Junliang Fan, Zimu Jiang +2

The thermal conductivity of natural diamond can be further improved by ~50% by eliminating isotope impurity to obtain pure 12C diamond. However, unlike isolated point defects, how…

cond-mat.mtrl-sci2026

Ultrahigh Thermal Conductivity in Isotopically Ultrapure Single-Crystal Diamond

Jinwen Liu, Junliang Fan, Zifeng Huang +1

Diamond has the highest thermal conductivity among natural materials. Reducing isotope scattering can further push the limit of thermal conductivity of diamond. Here, we report the…

cond-mat.mes-hall2026

Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements

Zifeng Huang, Yiyang Sun, Tianyu Jia +2

The increasing structural complexity of BEOL interconnect stacks in advanced integrated circuits demands a structure-aware thermal conductivity (\k{appa}) modeling framework. Howev…

physics.app-ph2026

Active Passivation Tunes Hotspot Locations in GaN Transistors with In Situ Thermal Mechanical Visualization

Yicheng Wei, Sihang Liu, Zimu Jiang +6

Efficient thermal dissipation has become critical in emerging electronic devices. However, most existing studies have primarily focused on engineering heat dissipation pathways, la…

cond-mat.mtrl-sci2026

High Thermal Conductivity in Back-End-of-Line Compatible AlN Thin Films

Xufei Guo, Zirou Chen, Zifeng Huang +3

With thermal issues becoming a major challenge to the development of integrated circuits (ICs), high-thermal-conductivity (high-TC) materials are gaining interest from both the ind…

cond-mat.mes-hall2026

Ion Implantation Enhanced Nucleation Facilitates Heat Transport across Atomically-Sharp Semiconductor Interfaces

Jinwen Liu, Zifeng Huang, Lina Yang +10

Overheating is a critical bottleneck limiting the performance and reliability of next-generation high-power and high-frequency electronics. Interfacial thermal resistance constitut…

cond-mat.mtrl-sci2025

Experimental Observation of Extremely Strong Defect-Phonon Scatterings in Semiconductor Single Crystals

Zifeng Huang, Jianbo Liang, Yuxiang Wang +5

The role of doping in tailoring thermal transport in semiconductors is critical for efficient thermal management in electronic devices. While the effects of doping have been extens…

cond-mat.mtrl-sci2024

Thermal Conductivity of Cubic Silicon Carbide Single Crystals Heavily Doped by Nitrogen

Zifeng Huang, Yunfan Yang, Da Sheng +7

High-purity cubic silicon carbide possesses the second-highest thermal conductivity among large-scale crystals, surpassed only by diamond, making it crucial for practical applicati…

cond-mat.mes-hall2024★ 3 cited

Interfacial reaction boosts thermal conductance of room-temperature integrated semiconductor interfaces stable up to 1100 C

Zhe Cheng, Xiaoyang Ji, Zifeng Huang +7

Overheating has emerged as a primary challenge constraining the reliability and performance of next-generation high-performance electronics, such as chiplets and (ultra)wide bandga…