2 papers
cond-mat.mtrl-sci2026
High Thermal Conductivity of Back-End-of-Line Compatible Diamond Films
Jinwen Liu, Chufei Cheng, Feifei Tan +6
Back-end-of-line (BEOL) thermal management requires electrically insulating heat-spreading dielectric that can be integrated within thermal budgets below 400 C. Here, we report pol…
physics.app-ph2026
Active Passivation Tunes Hotspot Locations in GaN Transistors with In Situ Thermal Mechanical Visualization
Yicheng Wei, Sihang Liu, Zimu Jiang +6
Efficient thermal dissipation has become critical in emerging electronic devices. However, most existing studies have primarily focused on engineering heat dissipation pathways, la…