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M. Wimplinger

1 paper hereh-index 141.2k citations142 works total

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  • last author1

Across the 1 of 1 paper where every author was matched, so the position is known.

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  • cs.OH1

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most citedNovel Bonding technologies for wafer-level transparent packaging of MOEMS

1 citations · 1 across the 1 of their papers we have counts for

collaborators

1 paper

cs.OH2008★ 1 cited

Novel Bonding technologies for wafer-level transparent packaging of MOEMS

H. Kirchberger, P. Lindler, M. Wimpliger

Depending on the type of Micro-Electro-Mechanical System (MEMS), packaging costs are contributing up to 80% of the total device cost. Each MEMS device category, its function and op…

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Not affiliated with arXiv. Researcher data from Semantic Scholar (ODC-BY) and OpenAlex.