2 citations · 2 across the 2 of their papers we have counts for
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cs.OH2008
Through Silicon Vias as Enablers for 3D Systems
E. Jung, Andreas Ostmann, Peter Ramm +3
This special session on 3D TSV's will highlight some of the fabrication processes and used technologies to create vias from the frontside of an active circuit to its backside and p…
cs.OH2008★ 2 cited
Lamination And Microstructuring Technology for a Bio-Cell Multiwell array
E. Jung, D. Manessis, A. Neumann +7
Microtechnology becomes a versatile tool for biological and biomedical applications. Microwells have been established long but remained non-intelligent up to now. Merging new fabri…