Timing resolution performance of Timepix4 bump-bonded assemblies

Riccardo Bolzonella, Jerome Alexandre Alozy, Rafael Ballabriga +15

The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\hat{I}¼\text{m}$ thick n-on-p silicon sensor is presented. A picosecond pu…