most citedHot-LEGO: Architect Microfluidic Cooling Equipped 3DICs with Pre-RTL Thermal Simulation

1 citations · 1 across the 5 of their papers we have counts for

collaborators

5 papers

cs.AR2025

WISP: Image Segmentation-Based Whitespace Diagnosis for Optimal Rectilinear Floorplanning

Xiaotian Zhao, Zixuan Li, Yichen Cai +1

The increasing number of rectilinear floorplans in modern chip designs presents significant challenges for traditional macro placers due to the additional complexity introduced by…

cs.CV2025

Back to Fundamentals: Low-Level Visual Features Guided Progressive Token Pruning

Yuanbing Ouyang, Yizhuo Liang, Qingpeng Li +5

Vision Transformers (ViTs) excel in semantic segmentation but demand significant computation, posing challenges for deployment on resource-constrained devices. Existing token pruni…

eess.SY2025

Extending Silicon Lifetime: A Review of Design Techniques for Reliable Integrated Circuits

Shaik Jani Babu, Fan Hu, Linyu Zhu +2

Reliability has become an increasing concern in modern computing. Integrated circuits (ICs) are the backbone of modern computing devices across industries, including artificial int…

cs.AR2025

Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs

Runxi Wang, Ziheng Wang, Ting Lin +3

The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design space exploration (DSE) to minimize design iterations and unex…

cs.AR20241 cited

Hot-LEGO: Architect Microfluidic Cooling Equipped 3DICs with Pre-RTL Thermal Simulation

Runxi Wang, Jun-Han Han, Mircea Stan +1

Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enable…