most citedNanoelectromechanical Systems (NEMS) for Hardware Security in Advanced Packaging

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cs.SE2026

Failure Analysis in Transition: An Industry Survey of Challenges, Priorities, and Standardization Needs in Advanced Packaging and Heterogeneous Integration

Himanandhan Reddy Kottur, Nusra Akter Takia, Mahamudul Hassan Fuad +3

Failure analysis is being reshaped by heterogeneous integration, chiplet-based architectures, hybrid bonding, backside technologies, & increasingly buried package structures. To ex…