29 citations · 42 across the 4 of their papers we have counts for
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cond-mat.mtrl-sci2026
Subgrain-resolved Analysis of Degradation in Cu Metallization via Scanning 3DXRD and Thermomechanical Modeling
Nikhil Prabhu, Laura Neumann, Michael Reisinger +7
Metallization layers play a key role in the performance and reliability of modern power semiconductor devices. During short-circuit events, rapid heating of power metallization lay…
cond-mat.mtrl-sci2026
Revealing 3D Strain and Carbide Architectures in Additively Manufactured Ni Superalloys
James A. D. Ball, David M. Collins, Yuanbo T. Tang +4
Fast directional solidification during Laser Additive Manufacturing (LAM) produces a complex microstructure in nickel-based superalloys, comprising columnar grains with cellular su…