2 citations · 3 across the 6 of their papers we have counts for
6 papers
Nanomolding single-crystalline CoIn3 and RhIn3 nanowires
Nghiep Khoan Duong, Christian D. Multunas, Thomas Whoriskey +8
Intermetallic compounds containing transition metals and group III-V metals tend to possess strong correlations and high catalytic activities, both of which can be enhanced via red…
Surface-dominant transport in Weyl semimetal NbAs nanowires for next-generation interconnects
Yeryun Cheon, Mehrdad T. Kiani, Yi-Hsin Tu +20
Ongoing demands for smaller and more energy efficient electronic devices necessitate alternative interconnect materials with lower electrical resistivity at reduced dimensions. Des…
1D-confined crystallization routes for tungsten phosphides
Gangtae Jin, Christian D. Multunas, James L. Hart +9
Topological materials confined in one-dimension (1D) can transform computing technologies, such as 1D topological semimetals for nanoscale interconnects and 1D topological supercon…
Wafer-scale fabrication of 2D nanostructures via thermomechanical nanomolding
Mehrdad T Kiani, Quynh P Sam, Yeon Sik Jung +2
With shrinking dimensions in integrated circuits, sensors, and functional devices, there is a pressing need to develop nanofabrication techniques with simultaneous control of morph…
Nanomolding of Metastable MoP
Mehrdad T Kiani, Quynh P Sam, Gangtae Jin +5
Reduced dimensionality leads to emergent phenomena in quantum materials and there is a need for accelerated materials discovery of nanoscale quantum materials in reduced dimensions…
Topological Metal MoP Nanowire for Interconnect
Hyeuk Jin Han, Sushant Kumar, Xiaoyang Ji +9
The increasing resistance of Cu interconnects for decreasing dimensions is a major challenge in continued downscaling of integrated circuits beyond the 7-nm technology node as it l…