36 citations · 38 across the 6 of their papers we have counts for
7 papers
2.5D Root of Trust: Securing the Chiplet Ecosystem
Charles Williams, Mohammed Nabeel, Gino Chacon +3
The semiconductor industry is rapidly transitioning from monolithic systems-on-chip toward heterogeneous, multi-vendor 2.5D chiplet ecosystems integrated via silicon interposers. W…
ORAP: Optimized Row Access Prefetching for Rowhammer-mitigated Memory
Maccoy Merrell, Daniel Puckett, Gino Chacon +3
Rowhammer is a well-studied DRAM phenomenon wherein multiple activations to a given row can cause bit flips in adjacent rows. Many mitigation techniques have been introduced to add…
Correct Wrong Path
Bhargav Reddy Godala, Sankara Prasad Ramesh, Krishnam Tibrewala +7
Modern OOO CPUs have very deep pipelines with large branch misprediction recovery penalties. Speculatively executed instructions on the wrong path can significantly change cache st…
Exposing Shadow Branches
Chrysanthos Pepi, Bhargav Reddy Godala, Krishnam Tibrewala +5
Modern processors implement a decoupled front-end in the form of Fetch Directed Instruction Prefetching (FDIP) to avoid front-end stalls. FDIP is driven by the Branch Prediction Un…
The Championship Simulator: Architectural Simulation for Education and Competition
Nathan Gober, Gino Chacon, Lei Wang +5
Recent years have seen a dramatic increase in the microarchitectural complexity of processors. This increase in complexity presents a twofold challenge for the field of computer ar…
Hardware Trojan Threats to Cache Coherence in Modern 2.5D Chiplet Systems
Gino A. Chacon, Charles Williams, Johann Knechtel +2
As industry moves toward chiplet-based designs, the insertion of hardware Trojans poses a significant threat to the security of these systems. These systems rely heavily on cache c…
Coherence Attacks and Countermeasures in Interposer-Based Systems
Gino Chacon, Tapojyoti Mandal, Johann Knechtel +3
Industry is moving towards large-scale systems where processor cores, memories, accelerators, etc.\ are bundled via 2.5D integration. These various components are fabricated separa…