84 citations · 430 across the 19 of their papers we have counts for
3 papers · 1 filter
Thermal-Aware Floorplanner for 3D IC, including TSVs, Liquid Microchannels and Thermal Domains Optimization
David Cuesta, José L. Risco-Martín, José L. Ayala +1
3D stacked technology has emerged as an effective mechanism to overcome physical limits and communication delays found in 2D integration. However, 3D technology also presents sever…
Green Adaptation of Real-Time Web Services for Industrial CPS within a Cloud Environment
Teresa Higuera, José L. Risco-Martín, Patricia Arroba +1
Managing energy efficiency under timing constraints is an interesting and big challenge. This work proposes an accurate power model in data centers for time-constrained servers in…
Boosting the 3D thermal-aware floorplanning problem through a master-worker parallel MOEA
Ignacio Arnaldo, Alfredo Cuesta-Infante, J. Manuel Colmenar +2
The increasing transistor scale integration poses, among others, the thermal-aware floorplanning problem; consisting of how to place the hardware components in order to reduce over…