2 papers
math.NA2026
WarpagePINN: Thermal Warpage Prediction in Advanced Packaging via a Two-Stage Physics-Informed Neural Networks
Xinyu Li, Min Tang, Zeyu Sun +3
Thermal warpage has become a critical issue in advanced packaging, primarily caused by the mismatch in coefficients of thermal expansion (CTE) among heterogeneously integrated mate…
cs.CE2025
Poisson Energy Formulation for Floorplanning: Variational Analysis and Mathematical Foundations
Wenxing Zhu, Hao Ai
Arranging many modules within a bounded domain without overlap, central to the Electronic Design Automation (EDA) of very large-scale integrated (VLSI) circuits, represents a broad…