2 papers
physics.app-ph2026
200 mm Wafer-Scale Monolithic 3D Integration of Atomic Layer-Deposited Oxide Semiconductors
Chang Niu, Linjia Long, Luqi Zheng +9
Monolithic 3D (M3D) integration offers a pathway to overcome the scaling limits of conventional silicon complementary metal-oxide-semiconductor (CMOS) technology by extending dense…
cs.AR2025
Cross-Layer Design of Vector-Symbolic Computing: Bridging Cognition and Brain-Inspired Hardware Acceleration
Shuting Du, Mohamed Ibrahim, Zishen Wan +7
Vector Symbolic Architectures (VSAs) have been widely deployed in various cognitive applications due to their simple and efficient operations. The widespread adoption of VSAs has,…