8 citations · 9 across the 4 of their papers we have counts for
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cs.AR2026
Multi-Partner Project: COIN-3D -- Collaborative Innovation in 3D VLSI Reliability
George Rafael Gourdoumanis, Fotoini Oikonomou, Maria Pantazi-Kypraiou +10
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), th…
cs.AR2022★ 8 cited
A Fast Semi-Analytical Approach for Transient Electromigration Analysis of Interconnect Trees using Matrix Exponential
Pavlos Stoikos, George Floros, Dimitrios Garyfallou +2
As integrated circuit technologies are moving to smaller technology nodes, Electromigration (EM) has become one of the most challenging problems facing the EDA industry. While nume…