2 papers
cs.AR2026
FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems
Yubo Hou, Sezin Kircali Ata, Gen Liang Lim +4
The placement of chiplets on a silicon interposer is a pivotal step in 2.5D system integration, yet existing placement approaches typically assume a pre-defined interposer footprin…
cs.LG2026
TDPNavigator-Placer: Thermal- and Wirelength-Aware Chiplet Placement in 2.5D Systems Through Multi-Agent Reinforcement Learning
Yubo Hou, Furen Zhuang, Partha Pratim Kundu +5
The rapid growth of electronics has accelerated the adoption of 2.5D integrated circuits, where effective automated chiplet placement is essential as systems scale to larger and mo…