24 citations · 45 across the 6 of their papers we have counts for
6 papers
ProForm: Solder-Free Circuit Assembly Using Thermoforming
Narjes Pourjafarian, Zhenming Yang, Jeffrey I. Lipton +2
Electronic waste (e-waste) is a growing global challenge, with millions of functional components discarded due to the difficulty of repair and reuse. Traditional circuit assembly r…
Localized Topological States beyond Fano Resonances via Counter-Propagating Wave Mode Conversion in Piezoelectric Microelectromechanical Devices
Jacopo M. De Ponti, Xuanyi Zhao, Luca Iorio +6
A variety of scientific fields like proteomics and spintronics have created a new demand for on-chip devices capable of sensing parameters localized within a few tens of micrometer…
Strong and Highly Switchable Soft Sticky Adhesives
Qianfeng Yin, Yilmaz Arin Manav, Yichen Wan +2
Many biological systems can form strong adhesion to various materials with complex shapes. The adhesion is further switchable between strongly adhering and completely non-adhering…
Quantum Transport in Graphene Using Surface Acoustic Wave Resonators
Yawen Fang, Yang Xu, Kaifei Kang +7
Surface acoustic waves (SAWs) provide a contactless method for measuring the wavevector-dependent conductivity. This technique has been used to discover emergent length scales in t…
HZO-based FerroNEMS MAC for In-Memory Computing
Shubham Jadhav, Ved Gund, Benyamin Davaji +4
This paper demonstrates a hafnium zirconium oxide (HZO)-based ferroelectric NEMS unimorph as the fundamental building block for very low-energy capacitive readout in-memory computi…
Ferroelectricity in Polar ScAlN/GaN Epitaxial Semiconductor Heterostructures
Joseph Casamento, Ved Gund, Hyunjea Lee +11
Room temperature ferroelectricity is observed in lattice-matched ~18% ScAlN/GaN heterostructures grown by molecular beam epitaxy on single-crystal GaN substrates. The epitaxial fil…