4 citations · 5 across the 3 of their papers we have counts for
3 papers
ProForm: Solder-Free Circuit Assembly Using Thermoforming
Narjes Pourjafarian, Zhenming Yang, Jeffrey I. Lipton +2
Electronic waste (e-waste) is a growing global challenge, with millions of functional components discarded due to the difficulty of repair and reuse. Traditional circuit assembly r…
Localized Topological States beyond Fano Resonances via Counter-Propagating Wave Mode Conversion in Piezoelectric Microelectromechanical Devices
Jacopo M. De Ponti, Xuanyi Zhao, Luca Iorio +6
A variety of scientific fields like proteomics and spintronics have created a new demand for on-chip devices capable of sensing parameters localized within a few tens of micrometer…
Ferroelectricity in Polar ScAlN/GaN Epitaxial Semiconductor Heterostructures
Joseph Casamento, Ved Gund, Hyunjea Lee +11
Room temperature ferroelectricity is observed in lattice-matched ~18% ScAlN/GaN heterostructures grown by molecular beam epitaxy on single-crystal GaN substrates. The epitaxial fil…