Chiplet3D: Pin- and Thermal-Aware 3D Chiplet Floorplanning via Convolution-Embedded MILP

Shuo Ren, Libo Shen, Yaohui Han +4

As traditional Moore's Law scaling slows down, 3D-ICs stack multiple active dies vertically to sustain performance scaling. However, this vertical stacking traps heat inside, makin…