1 citations · 2 across the 2 of their papers we have counts for
2 papers
cs.OH2008★ 1 cited
Formation of Embedded Microstructures by Thermal Activated Solvent Bonding
S. H. Ng, R. T. Tjeung, Z. F. Wang +3
We present a thermal activated solvent bonding technique for the formation of embedded microstrucutres in polymer. It is based on the temperature dependent solubility of polymer in…
cs.OH2007★ 1 cited
Process Issues for a Multi-Layer Microelectrofluidic Platform
S. -H. Ng, Z. -F. Wang, R. -T. Tjeung +1
We report on the development of some process capabilities for a polymer-based, multi-layer microelectrofluidic platform, namely: the hot embossing process, metallization on polymer…