18 citations · 26 across the 4 of their papers we have counts for
4 papers
Comparison of Two Low-Power Electronic Interfaces for Capacitive Mems Sensors
G. Nagy, Z. Szucs, S. Hodossy +2
The paper discusses the importance and the issues of interfacing capacitive sensors. Two architectures applicable for interfacing capacitive sensors are presented. The first soluti…
Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers
Z. Szucs, G. Nagy, S. Hodossy +2
In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for…
Electrical, thermal and optical characterization of power LED assemblies
A. Poppe, G. Farkas, G. Horvath
Besides their electrical properties the optical parameters of LEDs also depend on junction temperature. For this reason thermal characterization and thermal management play importa…
Thermal measurement and modeling of multi-die packages
A. Poppe, Y. Zhang, J. Wilson +3
Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stac…