78 citations · 79 across the 3 of their papers we have counts for
4 papers · 1 filter
Timing resolution performance of Timepix4 bump-bonded assemblies
Riccardo Bolzonella, Jerome Alexandre Alozy, Rafael Ballabriga +15
The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a thick n-on-p silicon sensor is presented. A picosecond pul…
Timing performance of the Timepix4 front-end
K. Heijhoff, K. Akiba, R. Ballabriga +7
A characterisation of the Timepix4 pixel front-end with a strong focus on timing performance is presented. Externally generated test pulses were used to probe the per-pixel time-to…
Timing measurements with a 3D silicon sensor on Timepix3 in a 180 GeV/c hadron beam
K. Heijhoff, K. Akiba, R. Bates +9
Test beam measurements have been carried out with a 3D sensor on a Timepix3 ASIC and the time measurements are presented. The measurements are compared to those of a thin planar se…
Production and Integration of the ATLAS Insertable B-Layer
B. Abbott, J. Albert, F. Alberti +373
During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, s…