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Weidong Zheng

4 papers hereh-index 10296 citations26 works total

Matching runs newest-first, so older work may not be attached to this profile yet.

author position
  • first author2
  • middle author2

Across the 4 of 4 papers where every author was matched, so the position is known.

fields
  • physics.app-ph3
  • cond-mat.mtrl-sci1
same name
  • Weidong Zheng — 2 papers, h 2
  • Weidong Zheng — 1 paper, h 4
  • Weidong Zheng — 1 paper, h 1

Either other researchers who publish under this name, or the same person where the external sources have not merged their records.

identity via Semantic Scholar / OpenAlex

collaborators

4 papers

physics.app-ph2022

Non-equilibrium Phonon Thermal Resistance at MoS2/Oxide and Graphene/Oxide Interfaces

Weidong Zheng, Connor J. McClellan, Eric Pop +1

Accurate measurements and physical understanding of thermal boundary resistance (R) of two-dimensional (2D) materials are imperative for effective thermal management of 2D electron…

cond-mat.mtrl-sci2018

Tuning electronic heat transport in graphene/metal heterostructures with ultralow thermal conductivity

Bin Huang, Weidong Zheng, Yee Kan Koh

Prior ultralow thermal conductivity materials are not suitable for thermoelectric applications due to the limited electronic transport in the materials. Here, we present a new clas…

physics.app-ph2018

Achieving huge thermal conductance of metallic nitride on graphene through enhanced elastic and inelastic phonon transmission

Weidong Zheng, Bin Huang, Hongkun Li +1

Low thermal conductance of metal contacts is one of the main challenges in thermal management of nanoscale devices of graphene and other 2D materials. Previous attempts to search f…

physics.app-ph2018

Anisotropic model with truncated linear dispersion for lattice and interfacial thermal transport in layered materials

Hongkun Li, Weidong Zheng, Yee Kan Koh

Recently, an anisotropic Debye model [Dames et al., Physical Review B 87, 12 (2013)] was proposed for calculations of the interfacial thermal conductance and the minimum thermal co…

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