4 papers
A Decomposition-Based Framework for Joint Optimization and Spatial Packaging of Interconnected Systems with Physical Interactions
Julian Bückmann, Jorn van Kampen, Theo Hofman
This paper presents an approach and application of optimization of spatial packaging of interconnected systems with physical interactions (SPI2) in three-dimensional component plac…
AI-Driven Synthesis for High-Tech System Design: Automating Innovation
Luuk Oerlemans, Steven Westerhof, Theo Hofman
This article addresses the combinatorial complexity inherent in modern high-tech system design by presenting automation-in-design (AiD) as a transformative paradigm. We propose com…
A Hybrid Optimization Framework for Spatial Packaging of Interconnected Systems
S. Westerhof, T. Hofman
This paper presents an optimization framework for Spatial Packaging of Interconnected Systems with Physical Interactions (SPI2) that addresses the geometric challenges of three-dim…
Spatial Optimization of Interconnected Systems in Non-Convex Design Spaces
S. Westerhof, T. Hofman
This paper presents a spatial optimization methodology that extends the Spatial Packaging of Interconnected Systems with Physical Interaction (SPI2) framework to support arbitrary,…