2 papers
cs.OH2026
A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
Max Bloomfield, Amogh Wasti, Zongmin Yang +6
Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain…
cond-mat.mes-hall2020
An iterative machine learning approach for discovering unexpected thermal conductivity enhancement in aperiodic superlattices
Prabudhya Roy Chowdhury, Xiulin Ruan
While machine learning (ML) has shown increasing effectiveness in optimizing materials properties under known physics, its application in challenging conventional wisdom and discov…