4 citations · 4 across the 5 of their papers we have counts for
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Silicon Photonic 2.5D Interposer Networks for Overcoming Communication Bottlenecks in Scale-out Machine Learning Hardware Accelerators
Febin Sunny, Ebadollah Taheri, Mahdi Nikdast +1
Modern machine learning (ML) applications are becoming increasingly complex and monolithic (single chip) accelerator architectures cannot keep up with their energy efficiency and t…
Machine Learning Accelerators in 2.5D Chiplet Platforms with Silicon Photonics
Febin Sunny, Ebadollah Taheri, Mahdi Nikdast +1
Domain-specific machine learning (ML) accelerators such as Google's TPU and Apple's Neural Engine now dominate CPUs and GPUs for energy-efficient ML processing. However, the evolut…
ReSiPI: A Reconfigurable Silicon-Photonic 2.5D Chiplet Network with PCMs for Energy-Efficient Interposer Communication
Ebadollah Taheri, Sudeep Pasricha, Mahdi Nikdast
2.5D chiplet systems have been proposed to improve the low manufacturing yield of large-scale chips. However, connecting the chiplets through an electronic interposer imposes a hig…