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cs.ET2024
Towards 3D AI Hardware: Fine-Grain Hardware Characterization of 3D Stacks for Heterogeneous System Integration & AI Systems
Eren Kurshan, Paul Franzon
3D integration offers key advantages in improving system performance and efficiency for the End-of-Scaling era. It enables the incorporation of heterogeneous system components and…
cs.ET2021
A Case for 3D Integrated System Design for Neuromorphic Computing & AI Applications
Eren Kurshan, Hai Li, Mingoo Seok +1
Over the last decade, artificial intelligence has found many applications areas in the society. As AI solutions have become more sophistication and the use cases grew, they highlig…