4 citations · 4 across the 3 of their papers we have counts for
3 papers
cs.CR2025
Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges
Peng Gu, Shuangchen Li, Dylan Stow +4
3D die stacking and 2.5D interposer design are promising technologies to improve integration density, performance and cost. Current approaches face serious issues in dealing with e…
cs.CR2025
Thermal-Aware 3D Design for Side-Channel Information Leakage
Dylan Stow, Russell Barnes, Eren Kurshan +1
Side-channel attacks are important security challenges as they reveal sensitive information about on-chip activities. Among such attacks, the thermal side-channel has been shown to…
cs.AR2021★ 4 cited
MPU: Towards Bandwidth-abundant SIMT Processor via Near-bank Computing
Xinfeng Xie, Peng Gu, Yufei Ding +3
With the growing number of data-intensive workloads, GPU, which is the state-of-the-art single-instruction-multiple-thread (SIMT) processor, is hindered by the memory bandwidth wal…