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cond-mat.mtrl-sci2026
Monolithic integration of diverse crystalline thin films on diamond for near-junction thermal management
Tiancheng Zhao, Tianqi Bai, Yang He +20
The pursuit of extreme miniaturization and high power in 6G RF front-ends has cast thermal dissipation as the central challenge. Here, we have demonstrated the monolithic integrati…
cond-mat.mtrl-sci2021
Thermal Visualization of Buried Interfaces by Transient and Steady-State Responses of Time-Domain Thermoreflectance
Zhe Cheng, Fengwen Mu, Xiaoyang Ji +6
Thermal resistances from interfaces impede heat dissipation in micro/nanoscale electronics, especially for high-power electronics. Despite the growing importance of understanding i…