130 citations · 238 across the 7 of their papers we have counts for
7 papers
Solid-state Janus nanoprecipitation enables amorphous-like heat conduction in crystalline Mg3Sb2-based thermoelectric materials
Rui Shu, Zhijia Han, Anna Elsukova +12
Solid-state precipitation can be used to tailor materials properties, ranging from ferromagnets and catalysts to mechanical strengthening and energy storage. Thermoelectric propert…
MgSbBi family: A promising substitute for the start-of-art n-type thermoelectric materials near room temperature
Rui Shu, Yecheng Zhou, Qi Wang +10
Bi2Te3-xSex family has been the n-type start-of-the-art thermoelectric materials near room temperatures (RT) for more than half-century, which dominates the active cooling and nove…
Anomalous CDW ground state in CuSe: a wave-like fluctuation of I-V curve near 50 K
Mengliang Yao, Weishu Liu, Xiang Chen +4
A charge density wave (CDW) ground state is observed in polycrystalline CuSe below 125 K, which corresponds to an energy gap of 40.9 meV and an electron-phonon coupling constan…
Topological Effect of Surface Plasmon Excitation in Gapped Isotropic Topological Insulator Nanowires
Mingda Li, Wenping Cui, Lijun Wu +5
We present a theoretical investigation of the surface plasmon (SP) at the interface between topologically non-trivial cylindrical core and topological-trivial surrounding material,…
Thermal Stability of Thermoelectric Materials via In Situ Resistivity Measurements
K. C. Lukas, W. S. Liu, Q. Jie +2
An experimental setup for determining the electrical resistivity of several types of thermoelectric materials over the temperature range 20 < T < 550 C is described in detail. One…
Transport Properties of Ni, Co, Fe, Mn Doped Cu0.01Bi2Te2.7Se0.3 for Thermoelectric Device Applications
Kevin C. Lukas, Weishu Liu, Zhifeng Ren +1
Bi2Te3 based thermoelectric devices typically use a nickel layer as a diffusion barrier to block the diffusion of solder or copper atoms from the electrode into the thermoelectric…
Experimental Determination of the Lorenz Number in Cu0.01Bi2Te2.7Se0.3 and Bi0.88Sb0.12
K. C. Lukas, W. S. Liu, G. Joshi +5
Nanostructuring has been shown to be an effective approach to reduce the lattice thermal conductivity and improve the thermoelectric figure of merit. Because the experimentally mea…