857 citations · 2.8k across the 41 of their papers we have counts for
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High Density Hybridisation Using ENIG Bumping and Anisotropic Conductive Films
Haripriya Bangaru, Giovanni Calderini, Dominik Dannheim +5
Fine-pitch hybridisation processes are essential for next-generation pixel detectors and high-density microelectronic assemblies. Conventional bump-bonding techniques, although rel…
Pixel column issue in the ATLAS Inner Tracker modules
L. Meng, R. Bates, C. Buttar +23
Pixel modules are currently being built for the ATLAS ITk Pixel detector upgrade. During the preproduction phase, recurring chip malfunctioning was observed during electrical testi…
Pixel detector hybridization and integration with anisotropic conductive adhesives
Alexander Volker, Janis Viktor Schmidt, Dominik Dannheim +10
A reliable and cost-effective interconnect technology is required for the development of hybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and d…
Performance of active edge pixel sensors
Marco Bomben, Audrey Ducourthial, Alvise Bagolini +9
To cope with the High Luminosity LHC harsh conditions, the ATLAS inner tracker has to be upgraded to meet requirements in terms of radiation hardness, pile up and geometrical accep…
Selected results from the static characterization of edgeless n-on-p planar pixel sensors for ATLAS upgrades
Gabriele Giacomini, Alvise Bagolini, Marco Bomben +7
In view of the LHC upgrade for the High Luminosity Phase (HL-LHC), the ATLAS experiment is planning to replace the Inner Detector with an all-Silicon system. The n-on-p technology…