2 citations · 2 across the 2 of their papers we have counts for
3 papers
Integration and Packaging
S. Mazza, R. Lipton, R. Patti +1
Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integr…
200 mm Sensor Development Using Bonded Wafers
M. Alyari, R. Bradford, M. Campanella +14
Sensors fabricated from high resistivity, float zone, silicon material have been the basis of vertex detectors and trackers for the last 30 years. The areas of these devices have i…
Design, Fabrication, and Testing of a Liquid Cooling Platform for High Power 3D-ICs
Chandrasekhar Mandalapu, Ibrahim M Abdel-Motaleb, Sangki Hong +1
3D integrated circuit (3D-IC) technology gained acceptance due to the ability to achieve extremely high level of integration, where hundreds of ICs are stacked vertically. Such lev…