2 citations · 2 across the 8 of their papers we have counts for
9 papers
AgentDV: Closed-Loop Agentic AI for Hardware Design Verification
Navya Goli, Junzhe Liu, Zhenge Jia +1
Register-transfer level (RTL) verification consumes a major part of modern system-on-chip (SoC) development effort. Yet, recent LLM-based verification-code generation often fails t…
LLM-as-Judge Framework for Evaluating Tone-Induced Hallucination in Vision-Language Models
Zhiyuan Jiang, Weihao Hong, Xinlei Guan +8
Vision-Language Models (VLMs) are increasingly deployed in settings where reliable visual grounding carries operational consequences, yet their behavior under progressively coerciv…
Toward Accountable AI-Generated Content on Social Platforms: Steganographic Attribution and Multimodal Harm Detection
Xinlei Guan, David Arosemena, Tejaswi Dhandu +7
The rapid growth of generative AI has introduced new challenges in content moderation and digital forensics. In particular, benign AI-generated images can be paired with harmful or…
CQ-CiM: Hardware-Aware Embedding Shaping for Robust CiM-Based Retrieval
Xinzhao Li, Alptekin Vardar, Franz Müller +6
Deploying Retrieval-Augmented Generation (RAG) on edge devices is in high demand, but is hindered by the latency of massive data movement and computation on traditional architectur…
SysVCoder: An LLM-Driven Framework for Systematic Generation of System-Level Design
Jian Zuo, Junzhe Liu, Xianyong Wang +6
Recent advances in large language models (LLMs) have demonstrated strong potential in generating hardware designs using hardware description languages (HDLs) such as Verilog. Howev…
Efficient and Scalable MIV-transistor with Extended Gate in Monolithic 3D Integration
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Monolithic 3D integration has become a promising solution for future computing needs. The metal inter-layer via (MIV) forms interconnects between substrate layers in Monolithic 3D…
FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Monolithic Three-Dimensional Integrated Circuits (M3D-IC) has become an attractive option to increase the transistor density. In M3D-IC, substrate layers are realized on top of pre…
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Metal inter-layer via (MIV) in Monolithic three-dimensional integrated circuits (M3D-IC) is used to connect inter-layer devices and provide power and clock signals across multiple…
An Improved Quadrature Voltage-Controlled Oscillator with Through-Silicon-Via Inductor in Three-dimensional Integrated Circuits
Dawei Li, Madhava Sarma Vemuri, Umamaheswara Rao Tida
Low-power quadrature voltage-controlled oscillator (QVCO) design utilizing transformer-feedback and current-reuse techniques with increased frequency range is proposed in this pape…