3 citations · 4 across the 2 of their papers we have counts for
2 papers
eess.SY2020★ 3 cited
Prediction of Component Shifts in Pick and Place Process of Surface Mount Technology Using Support Vector Regression
Shun Cao, Irandokht Parviziomran, Haeyong Yang +2
In pick and place (P&P) process of surface mount technology (SMT) the placed component can shift from its ideal (or designed) position on the wet solder paste. The solder paste wit…
math.OC2020★ 1 cited
Optimization of Passive Chip Components Placement with Self-Alignment Effect for Advanced Surface Mounting Technology
Irandokht Parviziomran, Shun Cao, Haeyong Yang +2
Surface mount technology (SMT) is an enhanced method in electronic packaging in which electronic components are placed directly on soldered printing circuit board (PCB) and are per…