51 citations · 78 across the 6 of their papers we have counts for
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Statistical Analysis for Component Shift in Pick and Place Process of Surface Mount Technology
Shun Cao, Irandokht Parviziomran, Krishnaswami Srihari +2
The placed electronic component can shift on the wet solder paste in pick and place (P&P) process of surface mount technology (SMT). It does not usually attract much attention, bec…
Prediction of Component Shifts in Pick and Place Process of Surface Mount Technology Using Support Vector Regression
Shun Cao, Irandokht Parviziomran, Haeyong Yang +2
In pick and place (P&P) process of surface mount technology (SMT) the placed component can shift from its ideal (or designed) position on the wet solder paste. The solder paste wit…
Data-Driven Prediction Model of Components Shift during Reflow Process in Surface Mount Technology
Irandokht Parviziomran, Shun Cao, Krishnaswami Srihari +1
In surface mount technology (SMT), mounted components on soldered pads are subject to move during reflow process. This capability is known as self-alignment and is the result of fl…
Optimization of Passive Chip Components Placement with Self-Alignment Effect for Advanced Surface Mounting Technology
Irandokht Parviziomran, Shun Cao, Haeyong Yang +2
Surface mount technology (SMT) is an enhanced method in electronic packaging in which electronic components are placed directly on soldered printing circuit board (PCB) and are per…