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eess.SY2020★ 3 cited
Prediction of Component Shifts in Pick and Place Process of Surface Mount Technology Using Support Vector Regression
Shun Cao, Irandokht Parviziomran, Haeyong Yang +2
In pick and place (P&P) process of surface mount technology (SMT) the placed component can shift from its ideal (or designed) position on the wet solder paste. The solder paste wit…
eess.SY2020★ 2 cited
Data-Driven Prediction Model of Components Shift during Reflow Process in Surface Mount Technology
Irandokht Parviziomran, Shun Cao, Krishnaswami Srihari +1
In surface mount technology (SMT), mounted components on soldered pads are subject to move during reflow process. This capability is known as self-alignment and is the result of fl…