2 citations · 2 across the 2 of their papers we have counts for
2 papers
physics.ins-det2020
Statistical Analysis for Component Shift in Pick and Place Process of Surface Mount Technology
Shun Cao, Irandokht Parviziomran, Krishnaswami Srihari +2
The placed electronic component can shift on the wet solder paste in pick and place (P&P) process of surface mount technology (SMT). It does not usually attract much attention, bec…
eess.SY2020★ 2 cited
Data-Driven Prediction Model of Components Shift during Reflow Process in Surface Mount Technology
Irandokht Parviziomran, Shun Cao, Krishnaswami Srihari +1
In surface mount technology (SMT), mounted components on soldered pads are subject to move during reflow process. This capability is known as self-alignment and is the result of fl…