From the 1 of 14 linked papers with an AI index.
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Network Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding
Patrick Iff, Tommaso Bonato, Maciej Besta +2
Transformer-based large language models are increasingly constrained by data movement as communication bandwidth drops sharply beyond the chip boundary. Wafer-scale integration usi…
FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates
Patrick Iff, Maciej Besta, Torsten Hoefler
Chiplet-based systems are rapidly gaining traction in the market. Two packaging options for such systems are the established organic substrates and the emerging glass substrates. T…
RapidChiplet: A Toolchain for Rapid Design Space Exploration of Chiplet Architectures
Patrick Iff, Benigna Bruggmann, Blaise Morel +3
Chiplet architectures are on the rise as they promise to overcome the scaling challenges of monolithic chips. A key component of such architectures is an efficient inter-chiplet in…
PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies
Patrick Iff, Benigna Bruggmann, Maciej Besta +2
2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low…