568 citations · 682 across the 12 of their papers we have counts for
12 papers
Radiation tolerant, thin, passive CMOS sensors read out with the RD53A chip
Yannick Dieter, Michael Daas, Jochen Dingfelder +9
The radiation hardness of passive CMOS pixel sensors fabricated in 150 nm LFoundry technology is investigated. CMOS process lines are especially of interest for large-scale silicon…
BDAQ53, a versatile pixel detector readout and test system for the ATLAS and CMS HL-LHC upgrades
Michael Daas, Yannick Dieter, Jochen Dingfelder +13
BDAQ53 is a readout system and verification framework for hybrid pixel detector readout chips of the RD53 family. These chips are designed for the upgrade of the inner tracking det…
Recent Results from Polycrystalline CVD Diamond Detectors
RD42 Collaboration, L. Bäni, A. Alexopoulos +109
Diamond is a material in use at many nuclear and high energy facilities due to its inherent radiation tolerance and ease of use. We have characterized detectors based on chemical v…
EUDAQ A Data Acquisition Software Framework for Common Beam Telescopes
P. Ahlburg, S. Arfaoui, J. -H. Arling +54
EUDAQ is a generic data acquisition software developed for use in conjunction with common beam telescopes at charged particle beam lines. Providing high-precision reference tracks…
Compact, directional neutron detectors capable of high-resolution nuclear recoil imaging
I. Jaegle, P. M. Lewis, M. Garcia-Sciveres +10
We report on the design, production, and performance of compact 40-cm Time Projection Chambers (TPCs) that detect fast neutrons by measuring the three-dimensional (3D) ionizati…
Production and Integration of the ATLAS Insertable B-Layer
B. Abbott, J. Albert, F. Alberti +373
During the shutdown of the CERN Large Hadron Collider in 2013-2014, an additional pixel layer was installed between the existing Pixel detector of the ATLAS experiment and a new, s…
Characterization and Verification Environment for the RD53A Pixel Readout Chip in 65 nm CMOS
Marco Vogt, Hans Krüger, Tomasz Hemperek +3
The RD53 collaboration is currently designing a large scale prototype pixel readout chip in 65 nm CMOS technology for the phase 2 upgrades at the HL-LHC. The RD53A chip will be ava…
Radiation hard pixel sensors using high-resistive wafers in a 150 nm CMOS processing line
D. -L. Pohl, T. Hemperek, I. Caicedo +8
Pixel sensors using 8" CMOS processing technology have been designed and characterized offering the benefits of industrial sensor fabrication, including large wafers, high throughp…
Characterization of Fully Depleted CMOS Active Pixel Sensors on High Resistivity Substrates for Use in a High Radiation Environment
Toko Hirono, Marlon Barbero, Patrick Breugnon +12
Depleted CMOS active sensors (DMAPS) are being developed for high-energy particle physics experiments in high radiation environments, such as in the ATLAS High Luminosity Large Had…
A method for precise charge reconstruction with pixel detectors using binary hit information
David-Leon Pohl, Jens Janssen, Tomasz Hemperek +2
A method is presented to precisely reconstruct charge spectra with pixel detectors using binary hit information of individual pixels. The method is independent of the charge inform…
Characterization of proton irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK
A. La Rosa, M. Boscardin, M. Cobal +12
In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade. Some ass…
Functional characterization of irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK
A. La Rosa, M. Boscardin, M. Cobal +12
In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade.