3d ic design 1architectural simulation 1cache modeling 1performance evaluation 1power modeling 1thermal-aware floorplanning 1
From the 1 of 2 linked papers with an AI index.
2 papers
cs.AR2026
CLIP-3D: Closed-Loop Evaluation of Performance and Physical Constraints for 3D ICs
Shuo Ren, Libo Shen, Yaohui Han +6
The paper introduces CLIP-3D, a methodology that integrates power, cache, and thermal models with architectural simulation to evaluate the performance and physical constraints of 3…
cs.AR2026
CUTh-Solver: GPU-Accelerated Sparse Matrix Solver for High-Resolution Thermal Simulation of 3D ICs
Chenghan Wang, Zhen Zhuang, Shui Jiang +9
Coarse-grained thermal simulation tends to underestimate localized thermal issues, potentially missing critical hotspots. Accurate analysis, therefore, demands fine-grained informa…