23 citations · 40 across the 5 of their papers we have counts for
5 papers
Multi-scale plasticity homogenization of Sn-3Ag-0.5Cu: from β-Sn micropillars to polycrystals with intermetallics
Yilun Xu, Tianhong Gu, Jingwei Xian +4
The mechanical properties of -Sn single crystals have been systematically investigated using a combined methodology of micropillar tests and rate-dependent crystal plasticity mo…
Accessing slip activity in high purity tin with electron backscatter diffraction and measurement of slip strength
Tianhong Gu, Finn Giuliani, T. Ben Britton
Beta-tin has been used widely as an interconnect in modern electronics. To improve the understanding of the reliability of these components, we directly measure the critical resolv…
The role of lengthscale in the creep of Sn-3Ag-0.5Cu solder microstructures
Tianhong Gu, Christopher M. Gourlay, T. Ben Britton
Creep of directionally solidified Sn-3Ag-0.5Cu wt.% (SAC305) samples with near-<110> orientation along the loading direction and different microstructural lengthscale is investigat…
In-situ study of creep in Sn-3Ag-0.5Cu solder
Tianhong Gu, Vivian Tong, Christopher M. Gourlay +1
The creep behaviour and microstructural evolution of a Sn-3Ag-0.5Cu wt.% sample with a columnar microstructure have been investigated through in-situ creep testing under constant s…
In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint
Tianhong Gu, Christopher M. Gourlay, T. Ben Britton
The heterogeneous evolution of microstructure in a single Cu/SAC305/Cu solder joint is investigated using in-situ thermal cycling combined with electron backscatter diffraction (EB…