3 papers
physics.app-ph2020
The role of lengthscale in the creep of Sn-3Ag-0.5Cu solder microstructures
Tianhong Gu, Christopher M. Gourlay, T. Ben Britton
Creep of directionally solidified Sn-3Ag-0.5Cu wt.% (SAC305) samples with near-<110> orientation along the loading direction and different microstructural lengthscale is investigat…
cond-mat.mtrl-sci2020
In-situ study of creep in Sn-3Ag-0.5Cu solder
Tianhong Gu, Vivian Tong, Christopher M. Gourlay +1
The creep behaviour and microstructural evolution of a Sn-3Ag-0.5Cu wt.% sample with a columnar microstructure have been investigated through in-situ creep testing under constant s…
cond-mat.mtrl-sci2019
In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint
Tianhong Gu, Christopher M. Gourlay, T. Ben Britton
The heterogeneous evolution of microstructure in a single Cu/SAC305/Cu solder joint is investigated using in-situ thermal cycling combined with electron backscatter diffraction (EB…