18 citations · 47 across the 11 of their papers we have counts for
8 papers · 1 filter
Using a 4-megapixel hybrid photon counting detector for fast, lab-based nanoscale x-ray tomography
Jordan Fonseca, Zachary H. Levine, Joseph W. Fowler +8
Hybrid photon counting detectors (HPCDs) have unlocked new capabilities for x-ray-based measurements at synchrotrons around the world in the last 30 years. By leveraging independen…
Characterization of Silicon-Membrane TES Microcalorimeters for Large-Format X-ray Spectrometers with Integrated Microwave SQUID Readout
Avirup Roy, Robinjeet Singh, Joel C. Weber +17
We present the electro-thermal characterization of transition-edge sensor (TES) detectors suspended on Si membranes fabricated using a silicon-on-insulator (SOI) wafer. The use of…
Lithographic integration of TES microcalorimeters with SQUID multiplexer circuits for large format spectrometers
Robinjeet Singh, Avirup Roy, Daniel Becker +12
Arrays of hundreds or thousands of low temperature detectors have been deployed for many experiments, both bolometers for long wavelength applications and calorimeters for shorter…
A high-speed, high-resolution Transition Edge Sensor spectrometer for soft X-rays at the Advanced Photon Source
Orlando Quaranta, Don Jensen, Kelsey Morgan +12
This project explores the design and development of a transition edge sensor (TES) spectrometer for resonant soft X- ray scattering (RSXS) measurements developed in collaboration b…
A tabletop x-ray tomography instrument for nanometer-scale imaging: demonstration of the 1,000-element transition-edge sensor subarray
Paul Szypryt, Nathan Nakamura, Daniel T. Becker +28
We report on the 1,000-element transition-edge sensor (TES) x-ray spectrometer implementation of the TOMographic Circuit Analysis Tool (TOMCAT). TOMCAT combines a high spatial reso…
Design of a 3000-pixel transition-edge sensor x-ray spectrometer for microcircuit tomography
Paul Szypryt, Douglas A. Bennett, William J. Boone +28
Feature sizes in integrated circuits have decreased substantially over time, and it has become increasingly difficult to three-dimensionally image these complex circuits after fabr…