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20192021
most citedA comprehensive first-principles analysis of phonon thermal conductivity and electron-phonon coupling in different metals

259 citations · 389 across the 8 of their papers we have counts for

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Showing cond-mat.mtrl-sciShow all

5 papers · 1 filter

cond-mat.mtrl-sci2021★ 67 cited

Ultralow thermal conductivity in two-dimensional MoO

Zhen Tong, Traian Dumitrică, Thomas Frauenheim

Monolayer molybdenum trioxide (MoO) is an emerging two-dimensional (2D) material with high electrical conductivity. Using first-principles calculations and a Boltzmann transpor…

cond-mat.mtrl-sci2021★ 7 cited

Atomistic metrics of BaSO as an ultra-efficient radiative cooling material: a first-principles prediction

Zhen Tong, Joseph Peoples, Xiangyu Li +3

Radiative cooling has recently revived due to its significant potential as an environmentally friendly cooling technology. However, the design of particle-matrix cooling nanocompos…

cond-mat.mtrl-sci2020★ 1 cited

Anomalous thermal transport in metallic transition-metal nitrides originated from strong electron-phonon interactions

Shouhang Li, Ao Wang, Yue Hu +3

Metallic transition-metal nitrides (TMNs) are promising conductive ceramics for many applications, whose thermal transport is of great importance in device design. It is found meta…

cond-mat.mtrl-sci2019★ 6 cited

The use of strain and grain boundaries to tailor phonon transport properties: A first principles study of 2H-phase (Part II)

Evan Witkoske, Zhen Tong, Yining Feng +3

Transparent oxide materials, such as , a p-type transparent conducting oxide (TCO), have recently been studied for high temperature thermoelectric power generators and c…

cond-mat.mtrl-sci2019★ 259 cited

A comprehensive first-principles analysis of phonon thermal conductivity and electron-phonon coupling in different metals

Zhen Tong, Shouhang Li, Xiulin Ruan +1

Separating electron and phonon thermal conductivity components is imperative for understanding the principle thermal transport mechanisms in metals and highly desirable in many app…