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researcher

David Boyle

8 papers hereh-index 8260 citations16 works total

Matching runs newest-first, so older work may not be attached to this profile yet.

author position
  • middle author1
  • last author7

Across the 8 of 8 papers where every author was matched, so the position is known.

fields
  • cs.CR2
  • eess.AS2
  • cs.CL1
  • cs.ET1
  • cs.HC1
  • cs.LG1
same name
  • David Boyle — 2 papers

Either other researchers who publish under this name, or the same person where the external sources have not merged their records.

identity via Semantic Scholar / OpenAlex

activity
20192022
most citedThermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending

38 citations · 101 across the 5 of their papers we have counts for

collaborators
Showing cs.ETShow all

1 paper · 1 filter

cs.ET2020★ 38 cited

Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending

Freddie Hong, Connor Myant, David Boyle

Fabricating 3D printed electronics using desktop printers has become more accessible with recent developments in conductive thermoplastic filaments. Because of their high resistanc…

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Not affiliated with arXiv. Researcher data from Semantic Scholar (ODC-BY) and OpenAlex.