10 citations · 10 across the 2 of their papers we have counts for
3 papers
cs.AR2020
Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology
Rahul Mathur, Chien-Ju Chao, Rossana Liu +6
3D integration technologies are seeing widespread adoption in the semiconductor industry to offset the limitations and slowdown of two-dimensional scaling. High-density 3D integrat…
cs.AR2020★ 10 cited
Stack up your chips: Betting on 3D integration to augment Moore's Law scaling
Saurabh Sinha, Xiaoqing Xu, Mudit Bhargava +3
3D integration, i.e., stacking of integrated circuit layers using parallel or sequential processing is gaining rapid industry adoption with the slowdown of Moore's law scaling. 3D…
cs.AR2018
Standard Cell Library Design and Optimization Methodology for ASAP7 PDK
Xiaoqing Xu, Nishi Shah, Andrew Evans +3
Standard cell libraries are the foundation for the entire backend design and optimization flow in modern application-specific integrated circuit designs. At 7nm technology node and…