From the 1 of 9 linked papers with an AI index.
9 papers
Algorithms for generating planar networks simulating hierarchical patterns of cracks formed during film drying
Yuri Yu. Tarasevich, Andrei V. Eserkepov, Andrei S. Burmistrov
The paper studies the geometry and topology of hierarchical crack patterns formed in drying thin films, using image analysis and graph theory, and proposes three algorithms to gene…
Hierarchical crack patterns: Identification of crack generations
Yuri Yu. Tarasevich, Andrei S. Burmistrov, Andrei V. Eserkepov
Identifying crack generations from microscopic images of hierarchical crack patterns is challenging due to the lack of temporal information and sensitivity to image boundaries. Exi…
Electrical conductivity of a random nanowire network: comparison of two-dimensional and quasi-three-dimensional models
Yuri Yu. Tarasevich, Andrei V. Eserkepov
Although the two-dimensional model of random networks of metallic nanowires or carbon nanotubes is widely used, it significantly overestimates the number of contacts between elemen…
Electrical conductivity of randomly placed linear wires: a mean field approach
Yuri Yu. Tarasevich, Andrei V. Eserkepov, Irina V. Vodolazskaya
Using the mean-field approximation, a formula for the effective electrical conductivity of a two-dimensional system of randomly arranged conducting sticks with a given orientation…
Simulation of charged nanotubes self-assembly during evaporation of a sessile droplet on a substrate
Konstantin S. Kolegov, Irina V. Vodolazskaya, Andrei V. Eserkepov +1
The ability to control the morphology of the nanotube deposit formed during the evaporation of a sessile droplet on a substrate is of theoretical and practical interest. Such depos…
Effective medium theory for the electrical conductivity of random metallic nanowire networks
Yuri Yu. Tarasevich, Irina V. Vodolazskaya, Andrei V. Eserkepov
Interest in studying the conductive properties of networks made from randomly distributed nanowires is due to their numerous technological applications. Although the sheet resistan…