most citedPrediction of Component Shifts in Pick and Place Process of Surface Mount Technology Using Support Vector Regression

3 citations · 6 across the 5 of their papers we have counts for

collaborators

5 papers

cs.SI2020

Detecting Dynamic States of Temporal Networks Using Connection Series Tensors

Shun Cao, Hiroki Sayama

Many temporal networks exhibit multiple system states, such as weekday and weekend patterns in social contact networks. The detection of such distinct states in temporal network da…

physics.ins-det2020

Statistical Analysis for Component Shift in Pick and Place Process of Surface Mount Technology

Shun Cao, Irandokht Parviziomran, Krishnaswami Srihari +2

The placed electronic component can shift on the wet solder paste in pick and place (P&P) process of surface mount technology (SMT). It does not usually attract much attention, bec…

eess.SY20203 cited

Prediction of Component Shifts in Pick and Place Process of Surface Mount Technology Using Support Vector Regression

Shun Cao, Irandokht Parviziomran, Haeyong Yang +2

In pick and place (P&P) process of surface mount technology (SMT) the placed component can shift from its ideal (or designed) position on the wet solder paste. The solder paste wit…

eess.SY20202 cited

Data-Driven Prediction Model of Components Shift during Reflow Process in Surface Mount Technology

Irandokht Parviziomran, Shun Cao, Krishnaswami Srihari +1

In surface mount technology (SMT), mounted components on soldered pads are subject to move during reflow process. This capability is known as self-alignment and is the result of fl…

math.OC20201 cited

Optimization of Passive Chip Components Placement with Self-Alignment Effect for Advanced Surface Mounting Technology

Irandokht Parviziomran, Shun Cao, Haeyong Yang +2

Surface mount technology (SMT) is an enhanced method in electronic packaging in which electronic components are placed directly on soldered printing circuit board (PCB) and are per…