3 papers
physics.app-ph2020
Thermal Stress Analysis of Liquid-Cooled 3D-ICs
Sakib Islam, Ibrahim Abdel-Motaleb
It is known that 3D-ICs suffer from hot spot temperatures that can reach thousands of degrees, if they are not cooled to reasonable operating temperatures. The problem of hot spots…
physics.app-ph2020
Numerical Analysis of Liquid Cooling of 3D-ICs Using Embedded Channels
Sakib Islam, Ibrahim Abdel-Motaleb
Hot-spots are considered among the unavoidable consequences of the high integration density of 3D-ICs. Eliminating hot spots requires employing efficient cooling techniques. Using…
physics.app-ph2019
Investigation of the Dynamics of Liquid Cooling of 3D ICs
Sakib Islam, Ibrahim Abdel-Motaleb
Although 3D IC technology can provide very high integration density, they suffer from having hotspots that may reach thousands of degrees. To manage this heat, it is necessary to s…