most citedUnderstanding the role of threading dislocations on 4H-SiC MOSFET breakdown under high temperature reverse bias stress

37 citations · 37 across the 2 of their papers we have counts for

collaborators

4 papers

cond-mat.mtrl-sci2024

Impact of the NO annealing duration on the SiO2/4H-SiC interface properties in lateral MOSFETs: the energetic profile of the near-interface-oxide traps

Patrick Fiorenza, Marco Zignale, Marco Camalleri +5

In this work, the effects of the duration of the post deposition annealing (PDA) in nitric oxide (NO) on the properties of SiO2/4H-SiC interfaces in n-channel lateral MOSFETs are i…

physics.app-ph2024

Time Dependent Dielectric Breakdown in 4H-SiC power MOSFETs under positive and negative gate-bias and gate-current stresses at 200°C

P. Fiorenza, F. Cordiano, S. M. Alessandrino +6

The gate oxide lifetime in 4H-SiC power MOSFETs is typically assessed at fixed and constant gate bias stress, monitoring the time-dependent dielectric breakdown (TDDB).

physics.app-ph2020

Nanoscale insights on the origin of the Power MOSFETs breakdown after extremely long high temperature reverse bias stress

P. Fiorenza, M. Alessandrino, B. Carbone +8

In this work, the origin of the dielectric breakdown of 4H-SiC power MOSFETs was studied at the nanoscale, analyzing devices that failed after extremely long (three months) of high…

physics.app-ph202037 cited

Understanding the role of threading dislocations on 4H-SiC MOSFET breakdown under high temperature reverse bias stress

P. Fiorenza, M. Alessandrino, B. Carbone +7

The origin of dielectric breakdown was studied on 4H-SiC MOSFETs that failed after three months of high temperature reverse bias (HTRB) stress. A local inspection of the failed dev…